Telephonics Large Scale Integration

Mixed-Signal System-on-Chip (SoC)

High-performance, Cost-effective Solutions

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Telephonics Large Scale Integration (TLSI) integrates custom features into SoCs to sense, evaluate, control and communicate per customer requirements. TLSI has a history of developing and supplying high‑performance, mixed‑signal custom semiconductor solutions at very competitive cost points. Our solutions are well suited for low‑power, high‑voltage, rugged or harsh environments and can be found in automotive, industrial, defense, avionics and smart energy applications.

  • The Telephonics Advantage

    • Advanced system architecture and design expertise
    • High-performance analog design, both signal chain and control
    • Integration of soft and hard IP cores such as Analog to Digital Converters (ADC) and Digital to Analog Converters (DAC)
    • Integration of processor or Digital Signal Processing (DSP) cores as needed
    • Access to a wide range of process choices
  • Examples of Experience

    • Sensing circuitry
    • Microcontroller generated clock
    • System clocking
    • Signal conditioning sense AMP
    • 12‑bit ADC with 4‑way multiplexer (1 msps)
    • MOSFET drivers
    • High‑performance amplifiers
    • Customized signal conditioning features
    • Low‑noise signal processing
  • Microcontroller Features

    • 8‑, 16‑ and 32‑bit cores available
    • Customized program Flash
    • Boot ROM
    • EEPROM
    • RAM
    • CAN 2.0B, I2C and UARTs
    • Customized multiple 16‑bit drivers
  • Sample TLSI SoC ASIC Process Options

    • 90 nm CMOS 50 V
    • .18 µ CMOS 1.8 V/3.3 V Flash
    • .18 µ Silicon on Insulator (SOI) 1.8 V/5 V/140 V/200 V ‑ 6 metal/thick bond pads